SHENZHEN PULEIYA TECHNOLOGY CO..LTD

TSMC confirms the delay in construction of Japan's JASM second wafer fab project

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Update time : 2025-06-04

Wei Zhejia said that the main reason for the delay was that the traffic flow in the local area increased significantly due to a series of reasons such as the construction of JASM wafer factory, which led to dissatisfaction among local residents. He pointed out that before the construction of the factory, it took nearly an hour for nearby residents to drive only 10 to 15 minutes.


In order to ensure the travel with Kumamoto local residents, TSMC decided to postpone the construction of JASM's second wafer factory before local traffic conditions improved. At the same time, TSMC also communicated with customers on the project delay. It is worth noting that although TSMC has delayed the construction time, it does not intend to postpone the production time. It was originally planned that JASM's second wafer fab will be put into production in 2027.


It is understood that the JASM project (12-inch) is jointly ventured by TSMC, Sony, Toyota and others. The second phase (JASM Fab 2) is planned to be put into production in 2027. JASM Fab 2 plans to produce 6/7nm chips and 40nm mature process capacity, with a production capacity of 50,000 pieces per month. The first phase of this project (JASM Fab 1) has been officially mass-produced in Q4 2024, mainly producing 28/22nm automotive chips, with a target production capacity of 50,000 pieces per month.